AlSiC

CMC AlSiC heat spreader solutions are lightweight, rigid baseplates engineered for high-power electronics, IGBT modules, and semiconductor devices. They combine high thermal conductivity with low thermal expansion to reduce thermal stress and warpage during repeated thermal cycling. With strong dimensional stability, vibration resistance, customizable dimensions, and nickel-plated surfaces, CMC AlSiC heat spreaders provide a durable alternative to copper and Mo-Cu baseplates. Contact T-Global USA for material selection, custom dimensions, and application support.