Thank you to everyone who visited T-Global at SEMICON West 2026, held October 13–15 at Moscone Center in San Francisco.
Our team at Booth #2258 in the Taiwan Pavilion spent three days talking with visitors about thermal management for advanced packaging.
Thermal Solutions Featured at SEMICON West 2026
AlSiC heat spreaders combine 180–220 W/m·K thermal conductivity with a CTE of 7–9 ppm/°C. In advanced packages, the copper-to-silicon mismatch drives warpage, solder fatigue, and TIM pump-out as the package heats and cools. An AlSiC lid or heat spreader narrows that gap.
Indium foil is a solid metal TIM that deforms under clamping pressure to fill surface irregularities without forming a soldered joint. Its benefit scales with heat flux: at 100 W/cm², each 0.01 °C·cm²/W of interface impedance adds 1 °C. That makes metal TIMs worth their place in lidded CPU, GPU, and AI accelerator packages where polymer TIMs reach their limit. T-Global is preparing indium foil solutions for these interfaces.
TG-PCM095 softens at about 45°C and flows into microscopic surface gaps, forming a thin interface between a package and its heat spreader, cold plate, or heat sink. Phase change material is a common starting point in large 2.5D modules, since it pairs low interface resistance with a controlled bond line across stacks. It also suits AI and HPC packages that cycle through heating and cooling.
Thermal pads fill uneven gaps between components and cooling hardware. Silicone grades range from the high-thermal-conductivity TG-AM100 and the ultra-soft TG-AD66 to the fiberglass-reinforced TG-A9000F. Our non-silicone TG-APC94 is available where siloxane contamination is a concern. In advanced packaging assemblies, pads suit interfaces with wider bond lines where some assembly-height variation is acceptable. We offer comprehensive post-process services, including die-cutting pads to fit.
We appreciate the time you spent with us and the questions you brought.
If your next design is running hot, request a quote or sample. Our team will help you choose the right material.
SEMICON West 2026 Trade Show Information
Date: October 13-15,2026
Venue: Moscone Center
Location: San Francisco, CA
Booth #2258
Learn more at SEMICON West 2026
Stop by our booth to learn about advanced thermal materials!